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Tefzel™ ETFE HT-2188

Tefzel™ ETFE HT-2188 is a special purpose fluoroplastic resin available in translucent, 2.5-mm (0.1-in) pellets.

Teflon™ Fluoropolymers and the Semiconductor Industry Brochure

Each day, smart devices are connecting our world in ways like never before.

Teflon™ PTFE CFP 6000 X

Teflon™ PTFE CFP 6000 X is a polytetrafluoroethylene fine powder resin used primarily for paste extrusion.

Teflon™ FEP 100 Product Information

Teflon™ FEP 100 is a melt-processible copolymer of tetrafluoroethylene and hexafluoropropylene, without additives, that meets the requirements of ASTM D 2116 Type I.

Teflon™ PFA Fluoropolymer Film Properties Bulletin

Teflon™ PFA film is a transparent, thermoplastic film that can be heat sealed, thermoformed, vacuum formed, heat bonded, welded, metallized, laminated (combined with dozens of other materials), and used as an excellent hot-melt adhesive.

Teflon™ PTFE 650XT X Product Information

Teflon™ PTFE 650XT X is a polytetrafluoroethylene fine powder resin used primarily for paste extrusion

Teflon™ FEP 9302 Product Information

Teflon™ FEP 9302 is a melt-processible copolymer of tetrafluoroethylene and hexafluoropropylene, without additives, that meets the requirements of ASTM D 2116 Type IV.

Teflon™ PTFE 7C X Product Information

Teflon™ PTFE 7C X is a white powder with a small particle size. The small particle size of Teflon™ PTFE 7C X helps to minimize voids, even at relatively low molding pressures.

Teflon™ PTFE 605XT X

Teflon™ PTFE 605XT X is a polytetrafluoroethylene fine powder resin used primarily for paste extrusion.

AES 300 Adhesive

AES 300 Adhesive, an offering within our Advanced Electronic Solutions portfolio, is designed to meet next generation needs of 5G and 6G platforms, anticipating requirements for both wireless and digital future designs.